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| DLL-095R-2.14G DELAY LINE PRELIMINARY REV: 006, 12/02/04 TECHNICAL DESCRIPTION FEATURES * 2110 - 2170 MHz * LOW LOSS * LOW VSWR * SURFACE MOUNT * LOW COST MULTI-MIX(R) DELAY LINES APPLICATIONS * UMTS * BASE STATION POWER AMPLIFIER LINEARIZATION NETWORKS * FEED FORWARD * PRE-DISTORTION * ADAPTIVE INTERFERENCE CANCELLATION The DLL-095R-2.14G, a member of the Multi-Mix(R) DLL family of delay lines, provides a mean delay of 9.54 nS in the UMTS band and features low insertion loss and low VSWR. The DLL-095R-2.14G exhibits excellent phase linearity and amplitude flatness over the 2110 - 2170 MHz frequency range. The MultiMix(R) DLL-095R-2.14G is intended for use in power amplifier linearization networks such as feedforward and predistortion. DLL delay lines are fusion bonded multilayer stripline structures. The DLL series offers an excellent alternative to expensive coaxial and delay filter structures. The fusion bonding process yields a homgeneous monolithic dielectric structure with reliability, ruggedness and electrical and thermal performance that is superior to conventional adhesive bonding techniques. GENERAL SPECIFICATIONS FREQUENCY RANGE MHz 2110 - 2170 RETURN LOSS (dB MIN) 20 MEAN DELAY* (nS) 9.54 0.2 INSERTION LOSS (dB MAX) 5.8 PHASE DEVIATION (DEGREES MAX) 2.0 POWER HANDLING (WATTS) 15 RF INTERFACE AMPLITUDE FLATNESS (dB p-p) 0.15 SIZE/OUTLINE (Inches - l,w,h) 1.0 x 1.0 x 0.090 Surface Mount Specifications are based upon unit mounted on printed circuit board with 50 Ohm nominal impedance. *Mean delay refers to the group delay of the applied input signal through the network. The specified tolerance relates to unit-unit group delay variation. PACKAGE OUTLINE / MOUNTING CONFIGURATION 1.000 [25.40] HOT VIA 0.087 [2.21] HOT VIA GND GROUND PLANE OF UNIT SHOULD BE SOLDERED TO GROUND PLANE OF CIRCUIT BOARD FOR OPTIMUM PERFORMANCE. 2X 0.848 [21.54] 1.000 [25.40] 0.848 [21.54] 3X 0.037 [0.94] 1 ORIENTATION MARKER DENOTES PIN LOCATION 2 GND PIN 2 0.848 [21.54] 0.076 [1.93] SQ 2X 0.069 [1.77] 4X 0.076 [1.93] 4X 0.076 [1.93] PIN 1 50 OHM LINE .032 DIELECTRIC THICKNESS ER = 3.38 GROUND PLANE THE MULTI-MIX MICROTECHNOLOGY(R) GROUP IS ISO 9001:2000 REGISTERED U.S. Patent 6,099,677 and other Patents Pending. Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006 Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com 2X 0.848 [21.54] 0.037 TYP [0.94] |
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